Light emitting diode device and method for the same

ABSTRACT

A light emitting device includes: a substrate; a first electrode and a second electrode provided at a distance from each other on the substrate and extending in one direction; a plurality of light emitting diodes provided between the first electrode and the second electrode, and connected to the first electrode and the second electrode; and a residual pattern provided between at least one of the plurality of light emitting diodes and the substrate.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No.15/864,885, filed Jan. 8, 2018, which claims priority to and the benefitof Korean Patent Application No. 10-2017-0099811 filed in the KoreanIntellectual Property Office on Aug. 7, 2017, the entire contents ofwhich are incorporated herein by reference.

BACKGROUND 1. Field

This disclosure relates to a light emitting diode device and a methodfor manufacturing the same.

2. Description of the Related Art

In general, a light emitting diode (LED) is an element that emits lightat a predetermined wavelength when receiving an electric signal throughelectrodes connected to opposite ends thereof.

A light emitting device having nano-sized light emitting diodes may beconstructed by spraying (e.g depositing, sputtering, etc.) semiconductorlayers on neighboring lateral electrodes by using a spray device. Thenano-sized light emitting diodes are arranged on the lateral electrodesby forming an electromagnetic field between the lateral electrodes.

The above information disclosed in this Background section is only forenhancement of understanding of the background of the describedtechnology and therefore it may contain information that does not formprior art.

SUMMARY

The described technology has been made in an effort to provide a lightemitting device where a short-circuit between lateral electrodes havinglight emitting diodes arranged therebetween due to unexpected particlescan be prevented or substantially prevented, and a method formanufacturing the same.

In addition, embodiments of the present invention provide a lightemitting device of which a number of light emitting diodes arrangedbetween lateral electrodes is increased, and a method for manufacturingthe same.

One aspect of the present invention provides a light emitting devicethat includes: a substrate; a first electrode and a second electrode ata distance from each other on the substrate and extending in onedirection; a plurality of light emitting diodes between the firstelectrode and the second electrode, and connected to the first electrodeand the second electrode; and a residual pattern between at least one ofthe plurality of light emitting diodes and the substrate.

The residual pattern may have an area that is smaller than a singlelight emitting diode.

The residual pattern may include a material that is different from thesubstrate, the first electrode, the second electrode, and the lightemitting diodes.

The residual pattern may include at least one of an organic material, aninorganic material, and a metal oxide.

The residual pattern may be a photoresist pattern.

The light emitting device may further include a protrusion portionbetween the substrate and the second electrode.

The light emitting device may further include a first contact portion onthe first electrode, and contacting the first electrode and some of theplurality of light emitting diodes.

The light emitting device may further include a second contact portionon the second electrode, and contacting the second electrode and some ofthe plurality of light emitting diodes.

The light emitting device may further include at least one insulationpattern between the first contact portion and the second contactportion.

The plurality of light emitting diodes include first light emittingdiodes, at least one of a first end and a second end of each of thefirst light emitting diodes may contact at least one electrode of thefirst electrode and the second electrode on the at least one electrode,and the residual pattern may overlap the first light emitting diodes.

The plurality of light emitting elements may include second lightemitting diodes, a first end and a second end of each of the secondlight emitting diodes may contact the substrate, and the residualpattern does not overlap the second light emitting diodes.

In addition, one aspect of the present invention provides a method formanufacturing a light emitting device. The method includes: coating aplurality of light emitting diodes on a first electrode and a secondelectrode that are at a distance from each other on a substrate andextend in one direction; arranging the plurality of light emittingdiodes between the first electrode and the second electrode by formingan electromagnetic field between the first electrode and the secondelectrode; forming a contact pattern that contacts at least one of thefirst electrode and the second electrode and the plurality of lightemitting diodes; cleaning the substrate; and removing the contactpattern.

Removing the contact pattern may include forming a residual pattern thatis between at least one of the plurality of light emitting diodes andthe substrate.

The contact pattern may be one of a photoresist pattern, an inorganicpattern, or a metal oxide pattern.

According to an exemplary embodiment, a light emitting device of whichlateral electrodes between which the plurality of light emitting diodesare arranged can be prevented or substantially prevented from beingshort-circuited due to undesirable particles, and a method formanufacturing the light emitting device can be provided.

Further, a light emitting device of which a number of light emittingdiodes arranged between the lateral electrodes can be increased, and amethod for manufacturing the light emitting device can be provided.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a top plan view of a light emitting diode device according toan exemplary embodiment.

FIG. 2 is a cross-sectional view of FIG. 1, taken along the line II-II.

FIG. 3 is a flowchart of a method for manufacturing a light emittingdiode device according to another exemplary embodiment.

FIG. 4 to FIG. 7 are cross-sectional views of a method for manufacturinga light emitting diode device according to the other exemplaryembodiment.

DETAILED DESCRIPTION

Hereinafter, exemplary embodiments will be described in more detail withreference to the accompanying drawings. The present invention, however,may be embodied in various different forms, and should not be construedas being limited to only the illustrated embodiments herein.

The drawings and description are to be regarded as illustrative innature and not restrictive. Like reference numerals designate likeelements throughout the specification.

In addition, the size and thickness of each configuration shown in thedrawings are arbitrarily shown for better understanding and ease ofdescription, but the present invention is not limited thereto. In thedrawings, the thickness of layers, films, panels, regions, etc., areexaggerated for clarity.

It will be understood that when an element such as a layer, film,region, or substrate is referred to as being “on” another element, itcan be directly on the other element or intervening elements may also bepresent. In contrast, when an element is referred to as being “directlyon” another element, there are no intervening elements present. Further,the word “over” or “on” means positioning on or below the objectportion, but does not essentially mean positioning on the upper side ofthe object portion based on a gravity direction.

In addition, unless explicitly described to the contrary, the word“comprise” and variations such as “comprises” or “comprising” will beunderstood to imply the inclusion of stated elements but not theexclusion of any other elements.

Hereinafter, example embodiments will be described in more detail withreference to the accompanying drawings, in which like reference numbersrefer to like elements throughout. The present invention, however, maybe embodied in various different forms, and should not be construed asbeing limited to only the illustrated embodiments herein. Rather, theseembodiments are provided as examples so that this disclosure will bethorough and complete, and will fully convey the aspects and features ofthe present invention to those skilled in the art. Accordingly,processes, elements, and techniques that are not necessary to thosehaving ordinary skill in the art for a complete understanding of theaspects and features of the present invention may not be described.Unless otherwise noted, like reference numerals denote like elementsthroughout the attached drawings and the written description, and thus,descriptions thereof will not be repeated. In the drawings, the relativesizes of elements, layers, and regions may be exaggerated for clarity.

It will be understood that, although the terms “first,” “second,”“third,” etc., may be used herein to describe various elements,components, regions, layers and/or sections, these elements, components,regions, layers and/or sections should not be limited by these terms.These terms are used to distinguish one element, component, region,layer or section from another element, component, region, layer orsection. Thus, a first element, component, region, layer or sectiondescribed below could be termed a second element, component, region,layer or section, without departing from the spirit and scope of thepresent invention.

Spatially relative terms, such as “beneath,” “below,” “lower,” “under,”“above,” “upper,” and the like, may be used herein for ease ofexplanation to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. It will beunderstood that the spatially relative terms are intended to encompassdifferent orientations of the device in use or in operation, in additionto the orientation depicted in the figures. For example, if the devicein the figures is turned over, elements described as “below” or“beneath” or “under” other elements or features would then be oriented“above” the other elements or features. Thus, the example terms “below”and “under” can encompass both an orientation of above and below. Thedevice may be otherwise oriented (e.g., rotated 90 degrees or at otherorientations) and the spatially relative descriptors used herein shouldbe interpreted accordingly.

It will be understood that when an element or layer is referred to asbeing “on,” “connected to,” or “coupled to” another element or layer, itcan be directly on, connected to, or coupled to the other element orlayer, or one or more intervening elements or layers may be present. Inaddition, it will also be understood that when an element or layer isreferred to as being “between” two elements or layers, it can be theonly element or layer between the two elements or layers, or one or moreintervening elements or layers may also be present.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the presentinvention. As used herein, the singular forms “a” and “an” are intendedto include the plural forms as well, unless the context clearlyindicates otherwise. It will be further understood that the terms“comprises,” “comprising,” “includes,” and “including,” when used inthis specification, specify the presence of the stated features,integers, steps, operations, elements, and/or components, but do notpreclude the presence or addition of one or more other features,integers, steps, operations, elements, components, and/or groupsthereof. As used herein, the term “and/or” includes any and allcombinations of one or more of the associated listed items. Expressionssuch as “at least one of,” when preceding a list of elements, modify theentire list of elements and do not modify the individual elements of thelist.

As used herein, the term “substantially,” “about,” and similar terms areused as terms of approximation and not as terms of degree, and areintended to account for the inherent deviations in measured orcalculated values that would be recognized by those of ordinary skill inthe art. Further, the use of “may” when describing embodiments of thepresent invention refers to “one or more embodiments of the presentinvention.” As used herein, the terms “use,” “using,” and “used” may beconsidered synonymous with the terms “utilize,” “utilizing,” and“utilized,” respectively. Also, the term “exemplary” is intended torefer to an example or illustration.

The electronic or electric devices and/or any other relevant devices orcomponents according to embodiments of the present invention describedherein may be implemented utilizing any suitable hardware, firmware(e.g. an application-specific integrated circuit), software, or acombination of software, firmware, and hardware. For example, thevarious components of these devices may be formed on one integratedcircuit (IC) chip or on separate IC chips. Further, the variouscomponents of these devices may be implemented on a flexible printedcircuit film, a tape carrier package (TCP), a printed circuit board(PCB), or formed on one substrate.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which the present invention belongs. Itwill be further understood that terms, such as those defined in commonlyused dictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art and/orthe present specification, and should not be interpreted in an idealizedor overly formal sense, unless expressly so defined herein.

Hereinafter, referring to FIG. 1 and FIG. 2, a light emitting diodedevice according to an exemplary embodiment will be described.

FIG. 1 is a top plan view of a light emitting diode device according toan exemplary embodiment. FIG. 2 is a cross-sectional view of FIG. 1,taken along the line II-II.

Referring to FIG. 1 and FIG. 2, a light emitting diode device accordingto an exemplary embodiment is a device that emits light by using aplurality of nano-sized light emitting diodes.

The light emitting diode device includes a substrate 100, a firstelectrode 201, a second electrode 202, a plurality of light emittingdiodes 300, a residual pattern 400, a protrusion portion 500, a firstcontact portion 600, a second contact portion 700, first insulationpatterns 800, and second insulation patterns 900.

The substrate 100 may include at least one of glass, an organicmaterial, an inorganic material, a metal, and the like. The substrate100 may be rigid or may be flexible, foldable, or bendable. Thesubstrate 100 includes a substrate main body 110 and a buffer layer 120disposed on the substrate main body 110. The substrate main body 110 mayinclude at least one of the above-stated glass, organic material,inorganic material, and metal. The buffer layer 120 may be disposedthroughout the entire surface of the substrate main body 110. The bufferlayer 120 may include at least one of glass, an organic material, aninorganic material, and the like.

The first electrode 201 is disposed on the substrate 100, and extends ina first direction x and then extends while being branched multiple timesin a second direction y that crosses the first direction x.

The second electrode 202 is disposed on the substrate 100, and isdisposed apart from the first electrode 201. The second electrode 202extends in the first direction x, and then extends while being branchedmultiple times in the second direction y.

The first electrode 201 and the second electrode 202 may be alternatelyarranged.

The first electrode 201 and the second electrode 202 respectively aredepicted with straight-line shapes, but this is not restrictive. Thefirst electrode 201 and the second electrode 202 may have curved-lineshapes.

The first electrode 201 and the second electrode 202 are disposed on thesame plane on the substrate 100, but this is not restrictive. They maybe disposed on different planes on the substrate 110.

The first electrode 201 and the second electrode 202 may be concurrently(e.g. simultaneously) formed through one process, but this is notrestrictive. They may be sequentially formed through differentprocesses.

The plurality of light emitting diodes 300 are disposed between thefirst electrode 201 and the second electrode 202. The plurality of lightemitting diodes 300 are connected to the first electrode 201 and thesecond electrode 202.

The plurality of light emitting diodes 300 are substantially nano-sized.

The plurality of light emitting diodes 300 may include various knownlight emitting diodes included in a light emitting device, but this isnot restrictive. Any suitable known various light emitting diodesincluded in a display device can be used.

Each of the plurality of light emitting diodes 300 may have variousshapes such as a cylinder, a triangular column, a quadrangular column, aconical shape, and the like.

The plurality of light emitting diodes 300 are deposited (e.g. coated)on the first electrode 201 and the second electrode 202 in solution by adepositing device (e.g. a coating device) such as an inkjet printer, andthen may be arranged between the first electrode 201 and the secondelectrode 202 by an electromagnetic field formed between the firstelectrode 201 and the second electrode 202.

Here, the solution may be in the form of ink or paste in which theplurality of light emitting diodes 300 are mixed in a solvent.

Each of the plurality of light emitting diodes 300 has an aspect ratio,and the light emitting diodes 300 are aligned in various directionsbetween the first electrode 201 and the second electrode 202.

The plurality of light emitting diodes 300 include a first lightemitting diode 301 and a second light emitting diode 302. Althoughdiscussed as a first light emitting diode 301 and a second lightemitting diode 302, embodiments of the present invention are not limitedthereto. For example, in multiple embodiments, the plurality of lightemitting diodes 300 include a plurality of first light emitting diodesand a plurality of second of light emitting diode. In these embodiments,each diode in the first light emitting diodes has the propertiesdescribed in relation to the first light emitting diode 301 and eachdiode in the second light emitting diodes has the properties describedin relation to the second light emitting diode 302.

At least one of a first end and a second end of the first light emittingdiode 301 contacts at least one electrode on at least one of the firstelectrode 201 and the second electrode 202. For example, at least one ofopposite ends of the first light emitting diode 301 is disposed on atleast one of the first electrode 201 and the second electrode 202, andthe first light emitting diode 301 overlaps at least one of the firstelectrode 201 and the second electrode 202.

The residual pattern 400 is disposed between the first light emittingdiode 301 and the substrate 100.

A first end and a second end of the second light emitting diode 302contact the substrate 100. For example, opposite ends of the secondlight emitting diode 302 contacts the substrate 100, and the secondlight emitting diode 302 does not overlap the first electrode 201 andthe second electrode 202.

The residual pattern 400 is not disposed between the second lightemitting diode 302 and the substrate 100.

The residual pattern 400 is disposed between at least one of theplurality of light emitting diodes 300 and the substrate 100.

The residual pattern 400 overlaps at least one of the plurality of lightemitting diodes 300. The residual pattern 400 overlaps the first lightemitting diode 301 among the plurality of light emitting diodes 300 anddoes not overlap the second light emitting diode 302.

The residual pattern 400 has a smaller area compared to a single lightemitting diode among the plurality of light emitting diodes 300.

The residual pattern 400 includes a material that is different from thatof the substrate 100, the first electrode 201, the second electrode 202,and the light emitting diodes 300. The residual pattern 400 may includeat least one of an organic material, an inorganic material, and a metaloxide. For example, the residual pattern 400 may be a photoresistpattern.

The residual pattern 400 directly connects between the first lightemitting diode 301 and the substrate 100. Thus, the first light emittingdiode 301 can be prevented from being separated from the first electrode201 and the second electrode 202 through a manufacturing process. Asdescribed, the plurality of light emitting diodes 300 can be preventedfrom being separated from the first electrode 201 and the secondelectrode 202, the number of light emitting diodes 300 between the firstelectrode 201 and the second electrode 202 can be increased.

The protrusion portion 500 is disposed between the substrate 100 and atleast a portion of the second electrode 202. The protrusion portion 500protrudes upward from a surface of the substrate 100. The secondelectrode 202 protruded upward by the protrusion portion 500 is at thesurface of the protrusion portion 500.

Light emitted from the plurality of light emitting diodes 300 towardsthe protrusion portion 500 may be reflected upwards by the secondelectrode 202 protruded by the protrusion portion 500. Accordingly, theefficiency of light emitted from the plurality of light emitting diodes300 can be improved.

The first contact portion 600 is disposed on the first electrode 201,and contacts the first electrode 201 and a first portion of theplurality of light emitting diodes 300. The first contact portion 600may include a transparent conductive material, but this is notrestrictive.

The second contact portion 700 is disposed on the second electrode 202,and contacts the second electrode 202 and a second portion of theplurality of light emitting diodes 300. The second contact portion 700may include a transparent conductive material, but this is notrestrictive.

A part of the first contact portion 600 and a part of the second contactportion 700 are overlapped with each other on the plurality of lightemitting diodes 300.

The plurality of light emitting diodes 300 disposed between the firstelectrode 201 and the second electrode 202 are connected to the firstelectrode 201 and the second electrode 202 by the first contact portion600 and the second contact portion 700.

For example, the first light emitting diode 301 among the plurality oflight emitting diodes 300 may be directly connected to the firstelectrode 201 and the second electrode 202 by contacting the firstelectrode 201 and the second electrode 202, or may be indirectlyconnected to the first electrode 201 and the second electrode 202 bybeing disposed apart from the first electrode 201 and the secondelectrode 202. In the depicted embodiment, the first contact portion 600contacts the second electrode 202 and one part of the second lightemitting diode 302 and the second contact portion 700 contacts the firstelectrode 201 and the other part of the second light emitting diode 302.The second light emitting diode 302 is therefore connected with thefirst electrode 201 and the second electrode 202.

As described, the plurality of light emitting diodes 300 are connectedto the first electrode 201 and the second electrode 202 by the firstcontact portion 600 and the second contact portion 700 even though someof the light emitting diodes 300 among the plurality of light emittingdiodes 300 are arranged at a distance from the first electrode 201 andthe second electrode 202. Accordingly, the plurality of light emittingdiodes 300 arranged between the first electrode 201 and the secondelectrode 202 wholly emit light even though some of the plurality oflight emitting diodes 300 may be separated from the first electrode 201or the second electrode 202 during the manufacturing process.

At least one insulation pattern is disposed between the first contactportion 600 and the second contact portion 700.

The first insulation patterns 800 are on the plurality of light emittingdiodes 300, and are disposed between the plurality of light emittingdiodes 300 and the first contact portion 600 and between the firstcontact portion 600 and the second contact portion 700.

The second insulation patterns 900 are on the first insulation patterns800, and are disposed between the first insulation pattern 800 and thesecond contact portion 700 and between the first contact portion 600 andthe second contact portion 700.

As described, in the light emitting display according to an exemplaryembodiment, the residual pattern 400 directly connects between the firstlight emitting diode 301 and the substrate 100 so that the first lightemitting diode 301 can be substantially prevented from being separatedfrom the first electrode 201 and the second electrode 202 during themanufacturing process.

That is, because the plurality of light emitting diodes 300 can beprevented or substantially prevented from being separated from the firstelectrode 201 and the second electrode 202 during the manufacturingprocess, the number of light emitting diodes 300 disposed between thefirst electrode 201 and the second electrode 202 can be increased.

In addition, in the light emitting device according an the exemplaryembodiment, light emitted towards the protrusion portion 500 from theplurality of light emitting diodes 300 is reflected upward by the secondelectrode 202 protruded by the protrusion portion 500, therebyincreasing the efficiency of the light emitting diodes 300.

Further, in the light emitting device according to an exemplaryembodiment, the plurality of light emitting diodes 300 are connected tothe first electrode 201 and the second electrode 202 by the firstcontact portion 600 and the second contact portion 700. Thus, eventhough some of the light emitting diodes 300 are arranged at a distancefrom the first electrode 201 and the second electrode 202 during themanufacturing process, the plurality of light emitting diodes 300 can beconnected to the first electrode 201 and the second electrode 202.

That is, although some of the plurality of light emitting diodes 300arranged between the first electrode 201 and the second electrode 202are disposed at a distance from the first electrode 201 or the secondelectrode 202, all light emitting diodes 300 disposed between the firstelectrode 201 and the second electrode 202 can emit light.

In addition, in the light emitting device according to the exemplaryembodiment, the first electrode 201 and the second electrode 202,between which the plurality of light emitting diodes 300 are arranged,can be prevented or substantially prevented from being short-circuiteddue to undesirable particles by the residual pattern 400.

This will be described in detail below with reference to a method formanufacturing a light emitting device according to another exemplaryembodiment.

Hereinafter, referring to FIG. 3 to FIG. 7, a method for manufacturing alight emitting device according to another exemplary embodiment will bedescribed.

The above-described light emitting device may be manufactured by usingthe method for manufacturing a light emitting device according toanother exemplary embodiment, but the present invention is not limitedthereto.

FIG. 3 shows a flowchart of a method for manufacturing a light emittingdevice according to another exemplary embodiment.

FIG. 4 to FIG. 7 are cross-sectional views of a method for manufacturinga light emitting device according to another exemplary embodiment.

First, referring to FIG. 3 and FIG. 4, a plurality of light emittingdiodes 300 are coated on a first electrode 201 and second electrodes 202of a substrate 100 (S100).

For example, the plurality of light emitting diodes 300 are coated onthe first electrode 201 and the second electrodes 202 that extend in onedirection while having a distance from each other on the substrate 100.

A protrusion portion 500 is on the substrate 100. The substrate 100includes the buffer layer 120 on the substrate main body 110, and thefirst electrode 201 and the second electrode 202 are provided. In thiscase, the second electrode 202 overlaps the protrusion portion 500, andthe first electrode 201 is disposed between neighboring secondelectrodes 202.

In one embodiment, the plurality of light emitting diodes 300 are coatedin the form of ink or paste mixed with a solvent on the first electrode201 and the second electrodes 202 by a coating device such as an inkjetprinter. When the solvent is evaporated, the plurality of light emittingdiodes 300 are arranged on the first electrode 201 and the secondelectrodes 202. In this case, particles 10 unexpectedly mixed in thesolvent or injected during the manufacturing process are also disposedon the first electrode 201 and the second electrodes 202 together withthe plurality of light emitting diodes 300.

Next, the plurality of light emitting diodes 300 are arranged betweenthe first electrode 201 and the second electrodes 202 (S200).

For example, an electromagnetic field is formed between the firstelectrode 201 and the second electrode 202 by applying power to thefirst electrode 201 and the second electrode 202. The plurality of lightemitting diodes 300 are arranged between the first electrode 201 and thesecond electrodes 202 by the electromagnetic field formed between thefirst electrode 201 and the second electrodes 202.

Next, referring to FIG. 6, a contact pattern 402 that contacts theplurality of light emitting diodes 300 is formed (S300).

Referring to FIG. 5, a photoresist layer 401 is formed throughout thesubstrate 100.

In another exemplary embodiment, instead of the photoresist layer 401,one of an organic layer, an inorganic layer, and a metal oxide layer maybe formed throughout the substrate 100.

Next, referring to FIG. 6, the photoresist layer 401 is exposed anddeveloped by using a mask such that the contact pattern 402 thatcontacts at least one of the first electrode 201 and the secondelectrode 202 and the plurality of light emitting diodes 300 is formed.That is, the contact pattern 402 may be a photoresist pattern.

The contact pattern 402 may contact the first electrode 201 and a partof each of the plurality of light emitting diodes 300 that neighbor thefirst electrode 201, but this is not restrictive.

On the other hand, in another exemplary embodiment, the contact pattern402 that contacts at least one of the first electrode 201 and the secondelectrode 202 and the plurality of light emitting diodes 300 may beformed by etching one of an organic layer, an inorganic layer, and ametal oxide layer using a photolithography process.

That is, in the other exemplary embodiment, the contact pattern 402 maybe one of an organic pattern, an inorganic pattern, and a metal oxidepattern.

Next, the substrate 100 is cleaned (S400).

For example, the contact pattern 402 is formed by development, theparticles 10 disposed on the first electrode 201 and the secondelectrode 202 are separated from the first electrode 201 and the secondelectrode 202.

The substrate 100 may be cleaned by wet-etching or dry-etching.

Accordingly, the particles 10 disposed on the first electrode 201 andthe second electrode 202 are separated therefrom.

When the substrate 100 is cleaned, the contact pattern 402 contacts atleast one of the first electrode 201 and the second electrode 202 andthe plurality of light emitting diodes 300 so that the light emittingdiodes 300 can be prevented from being separated between the firstelectrode 201 and the second electrode 202.

In addition, the particles 10 disposed on the first electrode 201 andthe second electrode 202 are separated when the substrate 100 iscleaned, a short-circuit between the first electrode 201 and the secondelectrode 202 due to the particles 10 can be suppressed.

Next, referring to FIG. 7, the contact pattern 402 is removed (S500).

For example, the contact pattern 402, which may be a photoresistpattern, is removed by performing an ashing process.

In this case, the contact pattern 402 partially remains between at leastone of the plurality of light emitting diodes 300 and the substrate 100such that the residual pattern 400 is formed.

On the other hand, in another exemplary embodiment, the contact pattern402, which can be one of the organic pattern, the inorganic pattern, andthe metal oxide pattern can be removed by performing wet-etching ordry-etching.

Next, at least one contact portion and at least one insulation patternmay be provided on the plurality of light emitting diodes 300.

As described, according to the method for manufacturing the lightemitting device according to another exemplary embodiment, the contactpattern 402 contacts at least one of the first electrode 201 and thesecond electrode 202 and the plurality of light emitting diodes 300 whenthe substrate 100 is cleaned so that the plurality of light emittingdiodes 300 can be prevented or substantially prevented from beingseparated between the first electrode 201 and the second electrode 202.

That is, because the plurality of light emitting diodes 300 can beprevented or substantially from being separated from the first electrode201 and the second electrode 202 during the manufacturing process, thenumber of light emitting diodes 300 arranged between the first electrode201 and the second electrode 202 can be increased.

Further, in the method for manufacturing the light emitting deviceaccording to another exemplary embodiment, the particles 10 disposed onthe first electrode 201 and the second electrode 202 are separated whenthe substrate 100 is cleaned so that a short-circuit between the firstelectrode 201 and the second electrode 202 due to the particles 10 canbe suppressed.

While this disclosure has been described in connection with what ispresently considered to be practical example embodiments, it is to beunderstood that the invention is not limited to the disclosedembodiments, but, on the contrary, is intended to cover variousmodifications and equivalent arrangements included within the spirit andscope of the appended claims and their equivalents.

What is claimed is:
 1. A light emitting device comprising: a substrate;a first electrode and a second electrode on the substrate, the firstelectrode having a first lower surface facing the substrate and a firstupper surface opposite to the first lower surface and the secondelectrode having a second lower surface facing the substrate and asecond upper surface opposite to the second lower surface; a first lightemitting diode electrically connected to the first electrode and thesecond electrode; and a pattern between the first light emitting diodeand the substrate, wherein the first lower surface of the firstelectrode and the second lower surface of the second electrode directlycontact a same layer.
 2. The light emitting device of claim 1, whereinthe pattern is between the first electrode and the second electrode. 3.The light emitting device of claim 2, wherein the pattern is spacedapart from at least one of the first electrode and the second electrode.4. The light emitting device of claim 2, wherein at least a portion of alower surface of the first light emitting diode is in contact with thepattern.
 5. The light emitting device of claim 3, wherein the pattern isat the same layer as the first electrode and the second electrode. 6.The light emitting device of claim 1, wherein the pattern comprises atleast one of an organic material, an inorganic material, and a metaloxide.
 7. The light emitting device of claim 1, wherein the first lightemitting diode has a shape that extends in one direction, and a lengthof the pattern measured in the one direction is less than a length ofthe first light emitting diode measured in the one direction.
 8. Thelight emitting device of claim 1, wherein the first electrode isdirectly on the substrate.
 9. The light emitting device of claim 8,further comprising a first protrusion portion between the substrate andthe second electrode.
 10. The light emitting device of claim 1, furthercomprising a first contact portion on the first electrode and a secondcontact portion on the second electrode, wherein the first contactportion is in contact with the first electrode and at least one end ofthe first light emitting diode, and the second contact portion is incontact with the second electrode and at least one end of the firstlight emitting diode.
 11. The light emitting device of claim 10, furthercomprising at least one insulation pattern between the first contactportion and the second contact portion.
 12. The light emitting device ofclaim 11, wherein the insulation pattern comprises a first insulatingpattern on the first light emitting diode.
 13. The light emitting deviceof claim 12, wherein the first insulating pattern is in contact with thefirst light emitting diode, the first contact portion and the secondcontact portion, and the first contact portion and the second contactportion are spaced apart from each other on the first insulatingpattern.
 14. The light emitting device of claim 13, wherein theinsulating pattern further comprises a second insulating pattern whichis on the first insulating pattern and the first electrode portion. 15.The light emitting device of claim 14, wherein the second contactportion is on the second insulating pattern.
 16. The light emittingdevice of claim 1, further comprising a third electrode on thesubstrate, the third electrode having a third lower surface facing thesubstrate and a third upper surface opposite to the third lower surface,and a second light emitting diode electrically connected to the firstelectrode and the third electrode, wherein the first lower surface ofthe first electrode and the third lower surface of the third electrodedirectly contact the same layer.
 17. The light emitting device of claim16, wherein the second light emitting diode is directly on thesubstrate, and the pattern does not contact the second light emittingdiode.
 18. The light emitting device of claim 16, further comprising asecond protrusion portion between the substrate and the third electrode.19. The light emitting device of claim 16, further comprising a thirdcontact portion on the third electrode, wherein the first contactportion is in contact with the first electrode and at least one end ofthe second light emitting diode, and the third contact portion is incontact with the third electrode and at least one end of the third lightemitting diode.
 20. The light emitting device of claim 19, furthercomprising a third insulating pattern on the second light emittingdiode, wherein the first contact portion and the third contact portionare spaced apart from each other on the third insulating pattern.